1. Working principle

Megasonic cleaning method is a technique that uses high-frequency sound waves to generate tiny bubbles and explode on the surface of an object for cleaning. During the cleaning process, the cleaning solution is injected into the cleaning tank, and high-frequency sound waves are generated by an ultrasonic oscillator to vibrate the liquid molecules in the cleaning solution, forming tiny bubbles. When these tiny bubbles explode on the surface of an object, they can generate strong impact force, effectively removing stains and particles.

2. Application Fields

The megasonic cleaning method has been widely used in fields such as semiconductor, microelectronics, and nanotechnology. In the semiconductor manufacturing process, the megasonic cleaning method can be used to remove contaminants and residues on the wafer surface, improving the quality and reliability of the wafer. In the fields of microelectronics and nanotechnology, megasonic cleaning can be used to clean small devices and nanomaterials, ensuring their performance and stability.

3. Market prospects

In the wet cleaning equipment market, megasonic cleaning technology has been widely applied by multiple companies and has achieved good market response. With the continuous development of semiconductor, microelectronics, nanotechnology and other fields, the application prospects and development space of megasonic cleaning method are becoming increasingly broad. In the future, with the continuous advancement of technology and the reduction of equipment costs, the megasonic cleaning method will be more widely applied and promoted.

In summary, the megasonic cleaning method is an important technical route in wet cleaning equipment, with advantages such as efficient cleaning, non-destructive cleaning, and wide applicability. It is a very promising cleaning technology.

4. Types  

Slot style megasonic cleaning   

Spray type megasonic cleaning nozzle

Adhesive megasonic cleaning system

Tank acoustic cleaning  

Generally, mega sonic cleaning is suitable for removing particles of 0.1 to 0.3 μm in size, while ultrasonic cleaning is suitable for removing particles larger than 0.4 μm. The effect of mega sonic cleaning is more gentle

1MHz ultra-high frequency ultrasonic wave

The sound field is uniform, and the sound intensity can exceed 6W/cm ²

Stainless steel or quartz vibration plate

The unique transducer bonding technology ensures high stability and a longer service life

A mega acoustic generator based on second-generation semiconductor technology

5. Technical Parameters